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February 2009

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Subject:
From:
Bob Willis <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Bob Willis <[log in to unmask]>
Date:
Thu, 19 Feb 2009 11:39:34 -0000
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Totally agree with the master, but a little extra if you or anyone else is
using lead-free solder and considering using a copper barrier layer consider
the thickness of that layer. There have been a few producers who have not
increased the layer thickness from the standard used in a tin/lead process,
users then solder and very quickly are trying to the solder back to brass.

If they take too long the joint looks poor and the surface does not wet, if
they do it quickly the joint may look great but mechanically not very sound.

Bob Willis
2 Fourth Ave, Chelmsford, Essex, CM1 4HA England
Tel: (44) 1245 351502
Fax: (44) 1245 496123
Mobile: 07860 775858
 
www.ASKbobwillis.com
New Bob Willis "Printed Board Inspection & Quality Control Workshop" 24th
March www.ASKbobwillis.com/faworkshops.pdf
 
"Troubleshooting Your Assembly Yields Workshop" 25th March
www.ASKbobwillis.com/faworkshops.pdf
 
Book Bob's "Step by Step Failure Analysis Workshop" 22nd April
www.ASKbobwillis.com/faworkshops.pdf
 
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman
Sent: 18 February 2009 17:55
To: [log in to unmask]
Subject: Re: [TN] Soldering Alloy 260

Hi Ioan! Soldering to brass that does not have a barrier plating layer, 
such as copper or nickel, can result in solder joint integrity issues. 
There is the potential of the zinc in the brass diffusing into the solder 
joint causing a loss of solder joint integrity ("dezincification"). I 
recommend you either put a barrier plating layer on the item or assess the 
risk  of a loss of solder joint integrity on the functional performance of 
the unit in its use environment. Good Luck.

Dave Hillman
Rockwell Collins
[log in to unmask]




Ioan Tempea <[log in to unmask]> 
Sent by: TechNet <[log in to unmask]>
02/18/2009 08:38 AM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
Ioan Tempea <[log in to unmask]>


To
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Subject
[TN] Soldering Alloy 260






Dear Technos,
 
Anybody has experience with soldering a piece of Alloy 260 (brass with 30% 
Zn) onto a PCB? Regular SnPb solder for now, might be RoHS soon.
 
The board finish specified by the client is ImAg? Any issues with that?
 
Also, the final product will be outdoors in the not so mild Montreal 
climate, -40C is regular in winter and +35C in summer, with tons of salt 
thrown on the streets to fight the snow. Any concerns regarding the 
compatibility of brass with the PCB?
 
Thanks
 
Ioan Tempea, ing.
Ingénieur Principal Fabrication / Sr. Manufacturing Engineer 
 
30 ans déjà! - Already 30 years!
950 rue Bergar, Laval, Québec, H7L 5A1
t : 450-967-7100 ext : 244
Mtl : 514-990-5762
f : 450-967-7444
[log in to unmask]
www.digico.cc <http://www.digico.cc/> 
P N'imprimer que si nécessaire - Print only if you must
 

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