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February 2009

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Subject:
From:
Tom Burek <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Tom Burek <[log in to unmask]>
Date:
Mon, 16 Feb 2009 12:53:07 -0700
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text/plain (102 lines)
Thank you for your response.  Is it a much different situation if the mix 
was SN100C and SnPb?  Also, is it not true that SN100C is most similar to 
standard the standard SnPb HASL finish that the SAC finish?
Thank you again.


Tom Burek, CID+




Werner engelmaier <[log in to unmask]> 
02/16/2009 12:34 PM

To
[log in to unmask], [log in to unmask]
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Subject
Re: [TN] Lead Free solder compatibility






Hi Tom,
The reliability of SAC 305 is understood; the data for SN100C are scarce.
You are creating some mish-mush alloy, but they are all in the same family 
with the same Solidus and roughly the some Liquidus. So you are not 
getting the same situation you get when you mix SnPb and SAC.

Werner


-----Original Message-----
From: Tom Burek <[log in to unmask]>
To: [log in to unmask]
Sent: Mon, 16 Feb 2009 1:28 pm
Subject: [TN] Lead Free solder compatibility

Hello technetters,

I have a lead free solder question.  If I have a PCB with a SN100C finish 

and hand solder a component using  a tin Silver solder (SN96.5AG03 Cu.5), 

is there a possibility of creating a joint that may be less reliable, 

perhaps more brittle?



Thank you





Tom Burek, CID+



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