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February 2009

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Subject:
From:
Werner engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Werner engelmaier <[log in to unmask]>
Date:
Mon, 16 Feb 2009 14:34:43 -0500
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 Hi Tom,
The reliability of SAC 305 is understood; the data for SN100C are scarce.
You are creating some mish-mush alloy, but they are all in the same family with the same Solidus and roughly the some Liquidus. So you are not getting the same situation you get when you mix SnPb and SAC.

Werner


 


 

-----Original Message-----
From: Tom Burek <[log in to unmask]>
To: [log in to unmask]
Sent: Mon, 16 Feb 2009 1:28 pm
Subject: [TN] Lead Free solder compatibility










Hello technetters,
I have a lead free solder question.  If I have a PCB with a SN100C finish 
and hand solder a component using  a tin Silver solder (SN96.5AG03 Cu.5), 
is there a possibility of creating a joint that may be less reliable, 
perhaps more brittle?

Thank you


Tom Burek, CID+

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