John,
Because we were dealing with OSP we had to keep the temp down and
bake longer, we are baking at 110C for 2 hours. This is not enough to drive
off all the moisture but it is enough to reduce it to a point that it
doesn't impact our process. You are dealing with a HASL finish and should be
able to get away with baking them at a higher temp for a shorter period of
time. You will have to find out what works best for your application. It is
also important to note that you have a short window to work with as they
will start to absorb moisture as soon as they are removed from the oven. We
move them from the oven to a N2 chamber at the front of the line. This
allows us to keep up with our line.
Also we use pallets for all our flex circuits at the end of our line
we have a cooling station with four fans that cool the pallets quickly so
that they can be reused safely and have minimal impact on the process. I
have attached photos of it. They fit vertically into the fixture and cool
quickly.
I would test your boards before I would start baking. If there is no
reason to bake them I would avoid it, it's not a money maker. I am sure you
have done a profile on this assembly, use that as a reference point and a
hot plate to see if the board blisters.
Regards,
Ted
-----Original Message-----
From: John Anselmo [mailto:[log in to unmask]]
Sent: Monday, February 02, 2009 4:30 PM
To: TechNet E-Mail Forum; Ted Tontis
Subject: RE: [TN] Bridging on SMD Connector
Ted,
The surface finish is HASL. I agree, HASL is a hasl for these parts.
But our customer is unwilling (at this point) to let us change to finish to
ENIG or IMM tin.
The stiffener is a .020" FR4 bonded to the flex with .002" adhesive.
At what temp and for how long did you bake the boards prior to reflow?
John
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Ted Tontis
Sent: Monday, February 02, 2009 3:05 PM
To: [log in to unmask]
Subject: Re: [TN] Bridging on SMD Connector
John,
What is the surface finish? Once had an assembly with a fine pitch
connector and a HASL finish on it and no matter what we did we had
consistent bridging. We tried electroform stencils, changed print
directions, changed pressure, messed with the apertures, and changed print
blades. Finally we changed the finish and it resolved the problem.
Also what type of stiffener is being used and what type of adhesive
is being used to keep it in place? I have worked with two flex circuits that
used PSA material to hold a heat sink in place as well as a stiffener, both
blistered in the oven at reflow temperatures. For the assembly with the heat
sink we would get a lot of draw bridging pillowing of components all of them
were components over the heat sink. For the fine pitch connector, that had a
stiffener under it, we had solder bridging and coplanarity issues. Baking,
prior to reflow, has greatly reduced the number of defects.
Regards,
Ted
Hi all,
I am having some difficulties with bridging on an SMD connector and need
some help.
I've searched the archives for similar problems but have come up empty so
far. Below are the details:
We are placing two different JMD connectors, one 60 pin and one 80 pin.
Stencil: 5 mil stencil and the apertures are 1:1 with the pads (.020"
pitch, .012 pad width)
Paste: Kester R562 (use a new jar every day)
Parts: Flex boards with .010" stiffeners supported by carriers (the flex
panels are placed in a Durastone carrier that is recessed the thickness of
the panel).
Printer: MPM model AP25
We are measuring the paste parameters after printing with the CyberOptics
2000. The data shows lots of variation in paste volume and thickness.
I am not sure how accurate the data is since the Cyberoptics does not verify
correct alignment of the panel before it takes the measurement, but I do
agree we have variation.
In general, it shows the paste thickness to be .007" to .009".
We see slumping of the paste sometimes before placement, mostly after
placement.
I've changed the parameters of the printer (pressure, print speed, the snap
off distance to ensure we are getting on-contact printing).
I've also had the operator rotate the stencil 90 deg to see if there was a
difference in how we applied the paste (parallel or perpendicular to the
length of the aperture).
We are using metal squeegees on the printer.
All of the above changes have resulted in no noticeable reduction in the
number of bridges.
We are currently running a flex panel with 12 parts per array and we get 50%
to 100% bridging per panel. Now you see why I am pulling my hair out.
The room parameters (throughout the day) are 70 to 74 deg F and 25% to 30%
RH
My questions are:
1) What else can I look at that effects bridging?
2) Can the reflow (hot air forced) oven be causing some of the problem?
3) What should the paste thickness be with a 5 mil stencil?
4) Should we go to a .001" reduction in the aperture on the stencil? .002"
reduction?
5) Is our panel carrier causing the problem?
6) Will rubber squeegees make a difference?
Frustrated in Montana,
John
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
