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February 2009

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From:
jckim(김정철) <[log in to unmask]>
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TechNet E-Mail Forum <[log in to unmask]>, jckim(김정철) <[log in to unmask]>
Date:
Mon, 16 Feb 2009 11:18:18 +0900
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I've gone through IPC-2221A again considering key concepts you kindly advised.

Basically it seems like a job of designers who knows overall requirements from base materials to complete products. : )



Anyhow I've seen important relations of 'current to allowable temp rise' and 'voltage to min. spacing between conductors'. 



In terms of current capacity, I should know allowable temp rise first before refering to the IPC-2221A Fig.6-4.

IPC-2152(final draft) seems to be useful to get more information.



And I guess UL recognition like min/max requirements for conductor and dielectric

is associated with the relations above in some extent.



Thanks a lot for your advise, Jack!

Have a good day.



jc



  ----- Original Message ----- 

  From: Jack Olson 

  To: [log in to unmask] 

  Sent: Saturday, February 14, 2009 12:27 AM

  Subject: Re: [TN] Permissible current and voltage in PCB





  wow, I just realized that ipc.org doesn't work,

  you have to use www.ipc.org



  (someone should fix that)

  onward thru the fog,

  Jack





  .

  On Fri, Feb 13, 2009 at 8:55 AM, Jack Olson <[log in to unmask]> wrote:



  > There is no such thing as "permissible current and voltage"

  > in circuit board design, (except by safety regulations, and

  > those requirements differ).

  >

  > There is a relationship between current, trace size and temperature

  > (which is described by the curves in IPC-2221 Figure 6-4)

  > so by increasing the current or decreasing the trace cross section,

  > you increase the temperature.

  >

  > The curves will show the "temperature rise" above ambient for

  > any given trace size and current. The key is in knowing what your

  > "ambient temperature" is.

  > ...and that's why we designers make the big bucks (just kidding!)

  >

  > The caution is that you don't want the temperature to affect

  > the integrity of the board material, so for example if the Tg of

  > a particular material is 170 degrees C, we may limit the maximum

  > operating temperature to something like 135 degrees C

  > (by adjusting the trace width or copper thickness, or by moving

  > the trace from an internal to an external layer, or by pouring copper

  > planes near it to dissipate the heat, etc.)

  >

  > also, clearances define maximum voltage, not trace size.

  >

  > You can get a better description of these concepts by downloading

  > a draft of the new IPC-2152 (Current Carrying Capacity) at ipc.org

  > under "Status of Standardization" in the Knowledge menu.

  >

  > hope that helps,

  > Jack

  >

  >



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