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February 2009

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TechNet E-Mail Forum <[log in to unmask]>, Inge <[log in to unmask]>
Date:
Fri, 13 Feb 2009 19:19:20 +0100
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text/plain (90 lines)
a whole sac?
Inge

----- Original Message ----- 
From: "Werner engelmaier" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, February 13, 2009 5:52 PM
Subject: Re: [TN] [tinwhiskers] - RoHS & BGAs!!!


> Hi Hani,
> If you needed underfill with SnPb solders, you will even more need it with 
> SAC.
> For testing, use IPC-9701.
>
> Werner
>
>
>
>
>
>
>
> -----Original Message-----
> From: AL-Yousef, Hani E <[log in to unmask]>
> To: [log in to unmask]; TechNet E-Mail Forum <[log in to unmask]>; 
> [log in to unmask]; SMART Group smart-e-link 
> <[log in to unmask]>
> Sent: Fri, 13 Feb 2009 11:27 am
> Subject: [tinwhiskers] - RoHS & BGAs!!!
>
>
>
>
>
>
>
>
>
>
>
> Hello All,
>
> I am in the hunt for information on how to best evaluate whether
> underfill is needed for SAC BGA when soldered with SAC paste.
>
> Also, part of my evolution is to find the right solder, flux and
> chemistry to clean afterwards. Further specify a cleanliness level.
>
> I guess one has to find to the right test to use to evaluate these
> parameters.
>
> Our products are expected to last for 20+ years while mounted outside on
> a power distribution pole mounts.
>
>
> I can use all the help I can get.
>
> Thanks
> Hani
>
>
>
>
>
>
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