Hi Hani,
If you needed underfill with SnPb solders, you will even more need it with SAC.
For testing, use IPC-9701.

Werner


 


 

-----Original Message-----
From: AL-Yousef, Hani E <[log in to unmask]>
To: [log in to unmask]; TechNet E-Mail Forum <[log in to unmask]>; [log in to unmask]; SMART Group smart-e-link <[log in to unmask]>
Sent: Fri, 13 Feb 2009 11:27 am
Subject: [tinwhiskers] - RoHS & BGAs!!!   











Hello All, 

I am in the hunt for information on how to best evaluate whether
underfill is needed for SAC BGA when soldered with SAC paste.    

Also, part of my evolution is to find the right solder, flux and
chemistry to clean afterwards. Further specify a cleanliness level.

I guess one has to find to the right test to use to evaluate these
parameters.   

Our products are expected to last for 20+ years while mounted outside on
a power distribution pole mounts.          


I can use all the help I can get. 

Thanks
Hani



 


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