Hi All,
I just got a look at the pics and I concur. I would discount "black pad"
but the comments on nickels' brittle nature and the ductility of copper
are right on the money.
Here is what I can add. The nickel appears thicker than usual unless the
copper is very thin. The thickness suggests electrolytic nickel. I have
plated with nickel sulfate, nickel sulfamate, nickel bromide and nickel
chloride. Some nickels will electrodeposit with stress at certain
current densities. The surface finish is rougher than I would expect. So
I wonder if this is really ENiG.
My vote is for brittle nickel.
Paul Reid
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bob Willis
Sent: Thursday, February 12, 2009 11:18 AM
To: [log in to unmask]
Subject: Re: [TN] CRACKED ENIG PADS
Looking at the proportions in the photos I would ask to confirm that the
nickel is what you think it is? It looks to thick in the first place
suggesting a different nickel?
Bob Willis
2 Fourth Ave, Chelmsford, Essex, CM1 4HA England
Tel: (44) 1245 351502
Fax: (44) 1245 496123
Mobile: 07860 775858
www.ASKbobwillis.com
New Bob Willis "Printed Board Inspection & Quality Control Workshop"
24th March www.ASKbobwillis.com/faworkshops.pdf
"Troubleshooting Your Assembly Yields Workshop" 25th March
www.ASKbobwillis.com/faworkshops.pdf
Book Bob's "Step by Step Failure Analysis Workshop" 22nd April
www.ASKbobwillis.com/faworkshops.pdf
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Paul Edwards
Sent: 11 February 2009 20:05
To: [log in to unmask]
Subject: Re: [TN] CRACKED ENIG PADS
Lee,
Without seeing into the barrel farther it looks as though something
actually deformed the hole and caused the pad metallization to crack...
But anyway you cut it good Au-Ni metallization should not crack...Has
someone checked the morphology of the plating???
Paul
Paul Edwards
Surface Art Engineering
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Lee Whiteman
Sent: Wednesday, February 11, 2009 11:42 AM
To: [log in to unmask]
Subject: Re: [TN] CRACKED ENIG PADS
Victor, George, Vladimir, and Company
Steve should be attaching the cross-section photograph. Since I did not
supervise the cross-sectioning activity, I will not vouch on the quality
of the cross-section.
I do see a layer (crack?) between the ENIG plating and the copper
surface, but the report that I received indicated that there was "no
evidence of a lack of bonding" - the lab reports words. That layer
(crack?) seems more pronounced than similar ENIG cross-sections I have
seen.
Lee Whiteman, PMP
Senior Member Engineering Staff
L-3 Communications East
Telephone: (856) 338-3508
FAX: (856) 338-2906
E-Mail: [log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez
Sent: Wednesday, February 11, 2009 2:23 PM
To: [log in to unmask]
Subject: Re: [TN] CRACKED ENIG PADS
Can you share the photos of the cross section?
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Wenger, George M.
Sent: Wednesday, February 11, 2009 12:51 PM
To: [log in to unmask]
Subject: Re: [TN] CRACKED ENIG PADS
Lee,
When you say "Evidently" that you have done cro
Lee,
When you say "Evidently" that you have done cross sectioning and see
that the cracks are only in the Ni and Au and not in the Cu? Since you
said "There was no evidence of a lack of bonding between the copper and
the ENIG finish" that implies to me that you did cross section but since
I wasn't sure I thought I'd ask.
Regards,
George
George M. Wenger
Andrew Wireless Solutions
Senior Principal FMA/Reliability Engineer 40 Technology Drive, Warren,
NJ 07059
(908) 546-4531 (Office) (732) 309-8964 (cell) [log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory
Sent: Wednesday, February 11, 2009 1:42 PM
To: [log in to unmask]
Subject: Re: [TN] CRACKED ENIG PADS
Hi Lee!
Have your pictures posted. They are here:
http://stevezeva.homestead.com/files/THROUGH_HOLE_CRACKS-1.jpg
http://stevezeva.homestead.com/files/THROUGH_HOLE_CRACKS-2.jpg
I have to let those that know more about plating than I do answer this
one...
Steve
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Lee Whiteman
Sent: Wednesday, February 11, 2009 12:20 PM
To: [log in to unmask]
Subject: [TN] CRACKED ENIG PADS
I have asked Steve to put up a pair of pictures I received. They are of
cracks within the ENIG finish of a PWB. I know that the board failed,
based on IPC-6011 and IPC-6012.
My question is what would cause the cracking? Evidently, it is in the
Nickel layer and the copper layer was not compromised. There was no
evidence of a lack of bonding between the copper and the ENIG finish.
These boards are fresh from the supplier.
Just curious...
Thanks in advance.
Lee Whiteman, PMP
Senior Member Engineering Staff
L-3 Communications East
Telephone: (856) 338-3508
FAX: (856) 338-2906
E-Mail: [log in to unmask]
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