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February 2009

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Subject:
From:
Werner engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Werner engelmaier <[log in to unmask]>
Date:
Wed, 11 Feb 2009 17:11:33 -0500
Content-Type:
text/plain
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text/plain (324 lines)
 Hi Mark, this is not 'Black Pad.'
Werner


 


 

-----Original Message-----
From: Woolley, Mark D. (Mark) <[log in to unmask]>
To: TechNet E-Mail Forum <[log in to unmask]>; Werner engelmaier <[log in to unmask]>
Sent: Wed, 11 Feb 2009 3:56 pm
Subject: RE: [TN] CRACKED ENIG PADS










Werner,
These would be very big grains in the nickel.  Is this possible that
this is the infamous "Black Pad" issue in profile?
mark


mark
Mark Woolley |PTRL Laboratory | Avaya | 1300 West 120th Ave |
Westminster, CO 80234
Voice (Lab): (303) 538-2166

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner engelmaier
Sent: Wednesday, February 11, 2009 1:52 PM
To: [log in to unmask]
Subject: Re: [TN] CRACKED ENIG PADS

 Well, these are cracks alright.


Werner


 


 

-----Original Message-----
From: Steve Gregory <[log in to unmask]>
To: [log in to unmask]
Sent: Wed, 11 Feb 2009 3:46 pm
Subject: Re: [TN] CRACKED ENIG PADS










Hi again Lee!

Got it! Here it is:

http://stevezeva.homestead.com/files/THROUGH_HOLE_CRACKS-3.jpg

Steve

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Lee Whiteman
Sent: Wednesday, February 11, 2009 1:42 PM
To: [log in to unmask]
Subject: Re: [TN] CRACKED ENIG PADS

Victor, George, Vladimir, and Company

Steve should be attaching the cross-section photograph. Since I did not
supervise the cross-sectioning activity, I will not vouch on the quality
of the cross-section.

I do see a layer (crack?) between the ENIG plating and the copper
surface, but the report that I received indicated that there was "no
evidence of a lack of bonding" - the lab reports words. That layer
(crack?) seems more pronounced than similar ENIG cross-sections I have
seen. 

Lee Whiteman, PMP
Senior Member Engineering Staff
L-3 Communications East
Telephone: (856) 338-3508
FAX: (856) 338-2906
E-Mail: [log in to unmask]
 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez
Sent: Wednesday, February 11, 2009 2:23 PM
To: [log in to unmask]
Subject: Re: [TN] CRACKED ENIG PADS

Can you share the photos of the cross section?



-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Wenger, George M.
Sent: Wednesday, February 11, 2009 12:51 PM
To: [log in to unmask]
Subject: Re: [TN] CRACKED ENIG PADS

Lee,

When you say "Evidently" that you have done cro


Lee,

When you say "Evidently" that you have done cross sectioning and see
that the cracks are only in the Ni and Au and not in the Cu?  Since you
said "There was no evidence of a lack of bonding between the copper and
the ENIG finish" that implies to me that you did cross section but since
I wasn't sure I thought I'd ask.

Regards,
George
George M. Wenger
Andrew Wireless Solutions
Senior Principal FMA/Reliability Engineer 40 Technology Drive, Warren,
NJ 07059
(908) 546-4531 (Office) (732) 309-8964 (cell) [log in to unmask]

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory
Sent: Wednesday, February 11, 2009 1:42 PM
To: [log in to unmask]
Subject: Re: [TN] CRACKED ENIG PADS

Hi Lee!

Have your pictures posted. They are here:

http://stevezeva.homestead.com/files/THROUGH_HOLE_CRACKS-1.jpg

http://stevezeva.homestead.com/files/THROUGH_HOLE_CRACKS-2.jpg

I have to let those that know more about plating than I do answer this
one...

Steve 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Lee Whiteman
Sent: Wednesday, February 11, 2009 12:20 PM
To: [log in to unmask]
Subject: [TN] CRACKED ENIG PADS

I have asked Steve to put up a pair of pictures I received. They are of
cracks within the ENIG finish of a PWB. I know that the board failed,
based on IPC-6011 and IPC-6012.

My question is what would cause the cracking? Evidently, it is in the
Nickel layer and the copper layer was not compromised. There was no
evidence of a lack of bonding between the copper and the ENIG finish.
These boards are fresh from the supplier.

Just curious...

Thanks in advance.

Lee Whiteman, PMP
Senior Member Engineering Staff
L-3 Communications East
Telephone: (856) 338-3508
FAX: (856) 338-2906
E-Mail: [log in to unmask]
 

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