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February 2009

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Subject:
From:
"Miller, Rodney" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Miller, Rodney
Date:
Tue, 10 Feb 2009 10:52:49 -0600
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text/plain
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text/plain (74 lines)
Thanks for the feedback.

I need to clarify, we already are potting, and fabricating tooling
in-house. 

I wasn't sure if there were any std's established in print or
certification to refer back to.

We currently overmold connectors and PCBA's which is very cool and
robust.  Some of our current designed products are active RF ID tag's.

 

-----Original Message-----
From: Croslin, Robert [mailto:[log in to unmask]] 
Sent: Tuesday, February 10, 2009 10:46 AM
To: TechNet E-Mail Forum; Miller, Rodney
Subject: RE: [TN] LPIM

Rodney, I checked with our supplier, a cable house named CompuLink that
does a considerable amount of custom low pressure molding for us.  They
suggested "Tell him to try www.cavist.com, there might be some info on
this web site."  It's been our experience that anything that's loose on
the board, like wires from a choke being soldered is a risk of being
broken when the plastic is injected.  We design to try to avoid those
conditions, but it still means some experimentation with the tool to get
the gates placed where they goo doesn't cause damage.  Good Luck! 


Bob Croslin
The Nielsen Company

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Miller, Rodney
Sent: Monday, February 09, 2009 4:03 PM
To: [log in to unmask]
Subject: [TN] LPIM

We recently began implementing Low Pressure Injection Molding for
harness, overmolding and even in lieu of PCB potting... it's really cool
stuff.

Is there  a standard out there on potting etc that I can elude to when
doing this process?  The technology is new, but it is killer for
protecting PCB in many applications and very cost effective over two
part materials.

Thanks,

Rodney

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