Thanks Werner
Will do
Very best,
Joe
In a message dated 2/9/2009 4:45:53 P.M. Pacific Standard Time,
[log in to unmask] writes:
Hi Joe,
Take a look at slide #13 of my Santa Clara Webinar promotion presentation,
to be given Feb 11.
It shows the model predictions for both SnPb and SAC405/305 and for both
accelerated testing [most typical mean test T and dwell time] and product
reliability [representative mean test T and dwell time]. Relative to the test
results it is somewhat on the conservative side in consideration of the idealized
conditions for accelerated testing.
Werner
-----Original Message-----
From: Joe Fjelstad <[log in to unmask]>
To: [log in to unmask]
Sent: Mon, 9 Feb 2009 7:26 pm
Subject: Re: [TN] lead adding
Thanks Werner.
That is positive news.
If I have this right then, so as long as someone makes a suitable solder
joint with no other intrinsic (in my thinking, the finish type) or
extrinsic
(in
my thinking, process parameters) issues, the model works for everything
from
BGAs and LGAs to QFPs, QFNs and FBGAs (with the standard GIGO caveat
relative to all the other required material properties used in the
analysis, of
course ;-)
How close does it map with testing and what finish was/is
employed/recommended?
Thanks again, Werner
Joe
In a message dated 2/9/2009 3:47:25 P.M. Pacific Standard Time,
[log in to unmask] writes:
Hi Joe,
This is for all lead types and components. Lead finishes do not affect
solder joint reliability--they may affect attachment reliability with
brittle
interfacial failures, but that is NOT the SJ failing. I do not know what you
mean
by 'all process variations', so I cannot answer that.
It pertains to solder joints made of either SAC405 or SAC305.
Werner
-----Original Message-----
From: Joe Fjelstad <[log in to unmask]>
To: [log in to unmask]
Sent: Mon, 9 Feb 2009 5:45 pm
Subject: Re: [TN] lead adding
Hi Werner
Is that over all finishes, lead types and process variations or just for
the
raw alloys in one or two scenarios?
I am guessing it is the latter. Is that right?
Cheers,
Joe
In a message dated 2/9/2009 12:49:48 P.M. Pacific Standard Time,
[log in to unmask] writes:
Hi,
We do now have a developed reliability prediction model for SAC405/305.
Werner
-----Original Message-----
From: Joyce Koo <[log in to unmask]>
To: [log in to unmask]
Sent: Mon, 9 Feb 2009 3:09 pm
Subject: Re: [TN] lead adding
Wondering with all added cost, is it still cheap go cots? Bring back the
mil
house may be better; you can have ultra fast asic, no up-rating screen,
and
lead-tin finishing plus well developed reliability prediction.
--------------------------
Sent using BlackBerry
----- Original Message -----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Mon Feb 09 15:01:17 2009
Subject: [TN] lead adding
Wow!
http://tinyurl.com/lead-over-tin
http://www.corfin.com/faq.htm
Bob Wilson
E/M Designer, CID+
SpectraSensors, Inc.
11027 Arrow Route
Rancho Cucamonga, CA 91730
(909) 948-4110
www.spectrasensors.com
www.ipc.org
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