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February 2009

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Subject:
From:
Joe Fjelstad <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Mon, 9 Feb 2009 19:26:09 EST
Content-Type:
text/plain
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text/plain (241 lines)
Thanks Werner. 
 
That is positive news.
 
If I have this right then, so as long as someone makes a suitable  solder 
joint with no other intrinsic (in my thinking, the finish type) or  extrinsic (in 
my thinking, process parameters) issues, the model works  for everything from 
BGAs and LGAs to QFPs, QFNs and FBGAs (with the  standard GIGO caveat 
relative to all the other required material properties used  in the analysis, of 
course ;-) 
 
How close does it map with testing and what finish was/is  
employed/recommended?
 
Thanks again, Werner
 
Joe 
   
 
 
In a message dated 2/9/2009 3:47:25 P.M. Pacific Standard Time,  
[log in to unmask] writes:

Hi  Joe,
This is for all lead types and components. Lead finishes do not affect  
solder joint reliability--they may affect attachment reliability with brittle  
interfacial failures, but that is NOT the SJ failing. I do not know what you  mean 
by 'all process variations', so I cannot answer that.
It pertains to  solder joints made of either SAC405 or SAC305.

Werner  







-----Original Message-----
From: Joe  Fjelstad <[log in to unmask]>
To: [log in to unmask]
Sent: Mon, 9 Feb  2009 5:45 pm
Subject: Re: [TN] lead  adding










Hi Werner

Is that  over all finishes, lead types and process variations or just  for 
the  
raw alloys in one or two scenarios? 

I am guessing it is the  latter. Is that right?

Cheers, 
Joe


In a message dated  2/9/2009 12:49:48 P.M. Pacific Standard Time,  
[log in to unmask]  writes:

Hi,  
We do now have a developed reliability prediction  model for   SAC405/305.


Werner








-----Original   Message-----
From: Joyce Koo <[log in to unmask]>
To:   [log in to unmask]
Sent: Mon, 9 Feb 2009 3:09 pm
Subject: Re: [TN]  lead  adding










Wondering with  all added  cost, is it still cheap go cots?  Bring back the 
mil  
house may be  better; you can have ultra fast asic, no up-rating  screen, and 
lead-tin  finishing plus well developed reliability  prediction.  
--------------------------
Sent using  BlackBerry


-----  Original Message -----
From: TechNet  <[log in to unmask]>
To:  [log in to unmask]  <[log in to unmask]>
Sent: Mon Feb 09 15:01:17  2009
Subject:  [TN] lead   adding

Wow!

http://tinyurl.com/lead-over-tin

http://www.corfin.com/faq.htm

Bob   Wilson
E/M Designer, CID+
SpectraSensors, Inc.
11027 Arrow   Route
Rancho Cucamonga, CA 91730
(909)   948-4110
www.spectrasensors.com
www.ipc.org



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