Hi Joe,
This is for all lead types and components. Lead finishes do not affect solder joint reliability--they may affect attachment reliability with brittle interfacial failures, but that is NOT the SJ failing. I do not know what you mean by 'all process variations', so I cannot answer that.
It pertains to solder joints made of either SAC405 or SAC305.
Werner
-----Original Message-----
From: Joe Fjelstad <[log in to unmask]>
To: [log in to unmask]
Sent: Mon, 9 Feb 2009 5:45 pm
Subject: Re: [TN] lead adding
Hi Werner
Is that over all finishes, lead types and process variations or just for the
raw alloys in one or two scenarios?
I am guessing it is the latter. Is that right?
Cheers,
Joe
In a message dated 2/9/2009 12:49:48 P.M. Pacific Standard Time,
[log in to unmask] writes:
Hi,
We do now have a developed reliability prediction model for SAC405/305.
Werner
-----Original Message-----
From: Joyce Koo <[log in to unmask]>
To: [log in to unmask]
Sent: Mon, 9 Feb 2009 3:09 pm
Subject: Re: [TN] lead adding
Wondering with all added cost, is it still cheap go cots? Bring back the
mil
house may be better; you can have ultra fast asic, no up-rating screen, and
lead-tin finishing plus well developed reliability prediction.
--------------------------
Sent using BlackBerry
----- Original Message -----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Mon Feb 09 15:01:17 2009
Subject: [TN] lead adding
Wow!
http://tinyurl.com/lead-over-tin
http://www.corfin.com/faq.htm
Bob Wilson
E/M Designer, CID+
SpectraSensors, Inc.
11027 Arrow Route
Rancho Cucamonga, CA 91730
(909) 948-4110
www.spectrasensors.com
www.ipc.org
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