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February 2009

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Subject:
From:
Werner engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Werner engelmaier <[log in to unmask]>
Date:
Mon, 9 Feb 2009 17:06:07 -0500
Content-Type:
text/plain
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text/plain (259 lines)
 Good luck on those---not enough data,

Werner


 


 

-----Original Message-----
From: Joyce Koo <[log in to unmask]>
To: [log in to unmask]; [log in to unmask]
Sent: Mon, 9 Feb 2009 4:02 pm
Subject: Re: [TN] lead adding











How about all the patented new alloy bga leadfree?  The balls are now with different additive to improve mech properties.  

--------------------------

Sent using BlackBerry









From: Werner engelmaier 

To: [log in to unmask] ; Joyce Koo

Sent: Mon Feb 09 15:48:46 2009
Subject: Re: [TN] lead adding






 Hi, 

We do now have a developed reliability prediction model for SAC405/305.




Werner






 





 



-----Original Message-----

From: Joyce Koo <[log in to unmask]>

To: [log in to unmask]

Sent: Mon, 9 Feb 2009 3:09 pm

Subject: Re: [TN] lead adding













Wondering with all added cost, is it still cheap go cots?  Bring back the mil 

house may be better; you can have ultra fast asic, no up-rating screen, and 

lead-tin finishing plus well developed reliability prediction. 

--------------------------

Sent using BlackBerry





----- Original Message -----

From: TechNet <[log in to unmask]>

To: [log in to unmask] <[log in to unmask]>

Sent: Mon Feb 09 15:01:17 2009

Subject: [TN] lead adding



Wow!



http://tinyurl.com/lead-over-tin



http://www.corfin.com/faq.htm



Bob Wilson

E/M Designer, CID+

SpectraSensors, Inc.

11027 Arrow Route

Rancho Cucamonga, CA 91730

(909) 948-4110

www.spectrasensors.com

www.ipc.org







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