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February 2009

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TechNet E-Mail Forum <[log in to unmask]>, Inge <[log in to unmask]>
Date:
Mon, 9 Feb 2009 22:01:40 +0100
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How can you have a prediction model for the solder alone? You mean solder 
plus X,X', X'', Y, Y', Y'' etc?
(I'm in a subordinate state today)
Seriously...I have been trying to find something too. Most  models are so 
generalized.
Inge

----- Original Message ----- 
From: "Werner engelmaier" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Monday, February 09, 2009 9:48 PM
Subject: Re: [TN] lead adding


> Hi,
> We do now have a developed reliability prediction model for SAC405/305.
>
>
> Werner
>
>
>
>
>
>
>
>
> -----Original Message-----
> From: Joyce Koo <[log in to unmask]>
> To: [log in to unmask]
> Sent: Mon, 9 Feb 2009 3:09 pm
> Subject: Re: [TN] lead adding
>
>
>
>
>
>
>
>
>
>
> Wondering with all added cost, is it still cheap go cots?  Bring back the 
> mil
> house may be better; you can have ultra fast asic, no up-rating screen, 
> and
> lead-tin finishing plus well developed reliability prediction.
> --------------------------
> Sent using BlackBerry
>
>
> ----- Original Message -----
> From: TechNet <[log in to unmask]>
> To: [log in to unmask] <[log in to unmask]>
> Sent: Mon Feb 09 15:01:17 2009
> Subject: [TN] lead adding
>
> Wow!
>
> http://tinyurl.com/lead-over-tin
>
> http://www.corfin.com/faq.htm
>
> Bob Wilson
> E/M Designer, CID+
> SpectraSensors, Inc.
> 11027 Arrow Route
> Rancho Cucamonga, CA 91730
> (909) 948-4110
> www.spectrasensors.com
> www.ipc.org
>
>
>
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