Hi David
When I talked with them on Friday they told me they were using a rosin
flux and following J-STD-002.  I didn't ask brand.

The one thing I asked them to do is to put a soldering iron on a few
leads (one at a time) and reflow the dip coating.  We have found that we
can dip tin these parts here with RMA flux, and have them look great,
but when we try to install them in CCAs it's a disaster.  We found that
applying a soldering iron on the lead we would find the solder would
dewet.  (Not sure dewet is the right term, but hopefully you see what I
mean)  I'm sure my test is not J-STD-002 compliant, but it works for
me...


regards,
 - Graham

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman
Sent: Friday, February 06, 2009 8:03 PM
To: [log in to unmask]
Subject: Re: [TN] Part solderability

Hi Graham - Please find out what flux (i.e. product name: Kester XXX or
Alpha YYY or Indium ZZZ, etc.)  the component fabricator used in his
test. 
Also find out which solderability specification did they use
(IPC-JSTD-002C or MIL-STD-XXX) and which solderability test method did
they use (Method A or B or...). If you can get those facts, I can tell
you if they followed the specification requirements. My guess is that
they used an incorrect flux.

Dave Hillman
JSTD-002 specification Chairman
[log in to unmask]




Graham Collins <[log in to unmask]> Sent by: TechNet
<[log in to unmask]>
02/06/2009 08:12 AM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
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Subject
[TN] Part solderability






Hi guys.
A while back I rejected a bunch of parts due to non wetting when we went

to solder them. 

The manufacturer has come back with a response to our guys, saying that 
they did a steam aging test on them and they passed fine.  He wants to 
discuss it with us.

Obviously this is not good - they pass his test but I can't solder the 
things.  Which makes me suspect his test... but makes him suspect my 
process.  I don't know enough about steam aging tests to discuss this 
well.  Obviously I need to ask what kind of flux he is using, but
anything 
else?

Our process is SnPb, we use RMA flux, and the wave soldering machine
runs 
at 500F for the pot.  This is on an assembly that we have happily built 
for about 7 years, with the same manufacturer of part, and no process 
changes that I can identify as significant.  The part is what I would
call 
marginally solderable, if we hand solder it and put a fair bit of heat
to 
the lead we can get it to solder, but not well or easily.  No previous 
soldering issues with the part.

regards,
 
Graham Collins
Halifax Production Engineering
L-3 communications Electronic Systems
(902) 873-2000 ext. 6215


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