Hi All,
My question is related to the soldering of IBM PPC CBGAs type components
(that have Sn90Pb10 solder balls) using Sn63 paste onto ENIG finished
boards. What are the "determining-factors" to improve the
wetting/diffusion of the eutectic solder paste into the high Sn solder
balls. The eutectic solder appears to wet well to the ENIG pads located
on the board but occasionally I see eutectic solder fillets that do not
always appear to fuse well with the high Sn content balls (if fuse is
the correct word?). thx
Best Regards,
-Joe
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