Hi Bev and fellow Techies

Yes it is being changed both for IPC and IEC.

The recommended temperature for lead-free is presently under  
consideration at 180DegC.

IPC-J-STD005 is under A Rev and the committee will be meeting to  
review some RR testing we are completing in time for APEX in Las Vegas.

I hope this helps

Graham Naisbitt
Gen3 Systems

On 19 Feb 2009, at 20:41, Bev Christian wrote:

> Technetters,
> I would like your opinion on this.
>
> IPC-TM-650, Method 2.4.35 Solder Paste - Slump Test--1/95 states that
> hot slump is measured after exposure to 150C for 10 to 15 minutes. Do
> you think this should be changed for lead free solder pastes?
> Bev
> RIM
>
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