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February 2009

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TechNet <[log in to unmask]>
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Date:
Mon, 9 Feb 2009 15:03:29 -0600
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TechNet E-Mail Forum <[log in to unmask]>, "Miller, Rodney" <[log in to unmask]>
Subject:
LPIM
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From:
"Miller, Rodney" <[log in to unmask]>
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We recently began implementing Low Pressure Injection Molding for
harness, overmolding and even in lieu of PCB potting... it's really cool
stuff.

Is there  a standard out there on potting etc that I can elude to when
doing this process?  The technology is new, but it is killer for
protecting PCB in many applications and very cost effective over two
part materials.

Thanks,

Rodney

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