Dear all,

As per IPC 600G 3.1.9, resin recession after thermal stress is not considered as a defect for all classes of boards unless specified in the procurement document. We have a high reliability customer who requires 3 times thermal stress ( 3 cycles of solder dip for 10 secs at 288 deg C) to be done, with a maximum allowable resin recession of 10%. We find this to be extremely stiff . Can anybody provide us a feedback on this and any suggestions to achieve this.

Rgds,

Pradeep.M
Assistant General Manager
Micropack Limited
Plot#16, Jigani Industrial Area,
Anekal Taluk, Bangalore - 562 106
India
Tel : 91 80 27825223 / 27825224
Fax : 91 80 27825225
email : [log in to unmask]
visit us @ www.micro-pack.com



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Micropack Ltd, Bangalore, India

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