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January 2009

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Subject:
From:
"Igoshev, Vladimir" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Igoshev, Vladimir
Date:
Thu, 15 Jan 2009 20:01:07 -0500
Content-Type:
text/plain
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text/plain (1 lines)
The info I'm asking about is at the bottom of the images you sent to Steve. You should be able to read from the originals what it says (how many microns)



Regards,



Vladimir



----- Original Message -----

From: Tan Geok Ang <[log in to unmask]>

To: TechNet E-Mail Forum <[log in to unmask]>; Igoshev, Vladimir

Sent: Thu Jan 15 19:53:13 2009

Subject: RE: [TN] Possible cause on open



The service lab has not come out much information at this time. Will

input you once I have the information. Thank you.



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Igoshev, Vladimir

Sent: Thursday, 15 January 2009 10:50 PM

To: [log in to unmask]

Subject: Re: [TN] Possible cause on open



It looks like there could be something fishy in the intermetallic layer.

GA, can you tell me please what is the reading on the micron bars?



Regards,



Vladimir



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory

Sent: Thursday, January 15, 2009 8:05 AM

To: [log in to unmask]

Subject: Re: [TN] Possible cause on open



Mornin' Everbody!

 

Well, here in Tulsa, we're just like a lot of other people in the

country this morning, trying to stay warm. Right now we're sitting at

-10 C. with a wind chill of -15 C. It's supposed to be colder

tomorrow...

 

GA, I have your pictures posted now. They're at:

 

http://stevezeva.homestead.com/files/Fracture1.jpg

 

http://stevezeva.homestead.com/files/Fracture2.jpg

 

Hopefully someone can give you some ideas...

 

Steve

 



________________________________



From: Tan Geok Ang [mailto:[log in to unmask]] 

Sent: Wednesday, January 14, 2009 7:27 PM

To: [log in to unmask]; Steve Gregory

Subject: Possible cause on open







Hi Steve,



            Please help to download these pictures TechNet, thanks.



     



 



 



Hi All experts,



            Testing (combine test of 16G at 85 oC) was performed on

evaluation boards with under-filled BGAs. Open issue (cracks) was

detected only at some corners of the BGA (35x35mm with 1156 balls) after

the test. Lead-free process and PCB with ENIG surface finish. Peak

temperature is 248 oC with a 65 sec above 217 oC. 



FYI, the service lab has not come out a report.



            What are the possible causes? (CET mismatches, Lead-free

alloy related, material, processes)



 



            Thank you in advance.



 



Regards



GA Tan



  





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