Hi Grunde,
I fully agree with you——and NO, there is no tightening of parameter ranges in 4101C.
Werner
-----Original Message-----
From: [log in to unmask]
To: TechNet E-Mail Forum <[log in to unmask]>; Werner engelmaier <[log in to unmask]>
Cc: [log in to unmask]
Sent: Thu, 4 Dec 2008 1:45 am
Subject: Re: [TN] Fwd: Draft for IPC-4101C
Does anybody know if the parameters
for td, ctez and moisture absorbtion will be tightened up in the new edition?
In the B revision these parameters very
much on the conservative for the "RoHS compliant" materials,
in my opinion the gap between actual parameters for the materials and 4101B
is now too large.
Best regards
Grunde
Werner engelmaier <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
04.12.2008 00:12
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
Werner engelmaier <[log in to unmask]>
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cc
Subject
[TN] Fwd: Draft for IPC-4101C
Guys & Gals,
Doug Sober wrote:
"I admit that we promised you consideration
for the C Revision.? We do need some testimonials for people that feel
that it
has value.
For sure your recipe makes sense and it does
provide a guide to lead-free assembly compatibility, however t
he materials
picked by this method are normally the higher Tg, higher priced and more
specialized FR-4.?
Customers cannot always purchase
specification sheet 126 materials.
But I would be willing to listen to the
testimonials. ?It is not going to happen for this revision however.
Doug"
Keep those 'testimonials' coming. I guess we do technology by democratic
principles.
Of course, you do not need /126 for most applications. My take on the 12
keyworded:
"Lead-free-FR-4" slash-sheet material groups in the C-rev is
as follows:
For Rev. C (Final Draft) /126, /129, /130 and /131 are fully compatible
with
/126 and /130 being the best choices because of their lower CTE(z), and
/99,
/124, /125 and /128 limited; the others [/101, /121, /122, /127] keyworded:
"Lead-free-FR-4' may be problematic with LF-soldering temperatures.
Just for reference, for Rev. B, /126 and /129 are fully compatible, /99
and
/124 to a more limited extent.
You should have an easily-applied tool to pre-select materials likely meeting
your needs.
Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com
-----Original Message-----
From: Sober, Doug <DSober@k
anekatexas.com>
To: [log in to unmask]; [log in to unmask]
Cc: [log in to unmask]; tony senese <[log in to unmask]>
Sent: Wed, 3 Dec 2008 4:14 pm
Subject: RE: Draft for IPC-4101C
Werner,
?
I admit that we promised you consideration
for the C Revision.? We do need some testimonials for people that feel
that it
has value.
?
For sure your recipe makes sense and it does
provide a guide to lead-free assembly compatibility, however the materials
picked by this method are normally the higher Tg, higher priced and more
specialized FR-4.?
?
Customers cannot always purchase
specification sheet 126 materials.
?
But I would be willing to listen to the
testimonials. ?It is not going to happen for this revision however.
?
Doug
?
From:
[log in to unmask] [mailto:[log in to unmask]]
Sent: Monday, December 01, 2008
5:32 PM
To: [log in to unmask]
Cc: Sober, Doug; [log in to unmask];
[log in to unmask]
Subject: Re: Draft for IPC-4101C
?
Hi Tom,
I am rather disappointed to find that the STII-concept has not been included
in
this draft. I was promised20that the concept would get serious consideration
and
be included in the C-revision 'if appropriate'.
Over 2 years have passed since I withdrew my NEGATIVE on the B-revision,
and
from what I can tell from the meeting minutes absolutely nothing has been
done
by the committee in this regard.
The STII-concept has found favorable interest by users both in the USA
and Europe, with some interest expressed in Asia as well. Its effectiveness
is clearly evident, it
does not take anything away from any of the materials, it makes selection
for
suitability much easier, and it combines the impact of the major parameters
affecting PCB survival/reliability.
So, clearly, the STII-concept is appropriate.
As this draft stands, it will receive a NEGATIVE from me.
Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com
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