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January 2009

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Subject:
From:
Steve Gregory <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Steve Gregory <[log in to unmask]>
Date:
Thu, 15 Jan 2009 07:04:38 -0600
Content-Type:
text/plain
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text/plain (73 lines)
Mornin' Everbody!
 
Well, here in Tulsa, we're just like a lot of other people in the
country this morning, trying to stay warm. Right now we're sitting at
-10 C. with a wind chill of -15 C. It's supposed to be colder
tomorrow...
 
GA, I have your pictures posted now. They're at:
 
http://stevezeva.homestead.com/files/Fracture1.jpg
 
http://stevezeva.homestead.com/files/Fracture2.jpg
 
Hopefully someone can give you some ideas...
 
Steve
 

________________________________

From: Tan Geok Ang [mailto:[log in to unmask]] 
Sent: Wednesday, January 14, 2009 7:27 PM
To: [log in to unmask]; Steve Gregory
Subject: Possible cause on open



Hi Steve,

            Please help to download these pictures TechNet, thanks.

     

 

 

Hi All experts,

            Testing (combine test of 16G at 85 oC) was performed on
evaluation boards with under-filled BGAs. Open issue (cracks) was
detected only at some corners of the BGA (35x35mm with 1156 balls) after
the test. Lead-free process and PCB with ENIG surface finish. Peak
temperature is 248 oC with a 65 sec above 217 oC. 

FYI, the service lab has not come out a report.

            What are the possible causes? (CET mismatches, Lead-free
alloy related, material, processes)

 

            Thank you in advance.

 

Regards

GA Tan

  


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