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January 2009

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Subject:
From:
Paul Reid <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Paul Reid <[log in to unmask]>
Date:
Fri, 2 Jan 2009 09:31:39 -0500
Content-Type:
text/plain
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text/plain (68 lines)
We find delamination and crazing on representative test coupons, by
means of capacitance changes between flooded planes. You can determine
which layer is delaminated and the magnitude but not the X/Y location of
the delamination using our method.

Testing coupons allows us to rank the propensity for delamination in the
board due to assembly and rework. It turns out that both material
robustness and construction, specifically grid size, are the major
influences in delamination. Baking to remove volatiles usually helps but
it can contribute to delamination also when the temperatures and bake
times are too aggressive. 

I am under the impression that ultrasound methods are limited to large
grid sizes and low layer counts. I doubt that ultra sound would have the
acuity to resolve crazing. 

Sincerely,

Paul Reid

Program Coordinator

PWB Interconnect Solutions Inc.
235 Stafford Rd., West, Unit 103
Nepean, Ontario
Canada, K2H 9C1

613 596 4244 ext. 229
Skype paul_reid_pwb
[log in to unmask] <mailto:[log in to unmask]>


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez
Sent: Friday, January 02, 2009 9:10 AM
To: [log in to unmask]
Subject: [TN] PWB Delamination Detection by C-SAM

Fellow TechNetters: 

   Searching for supporting information on non destructive analysis with
C-SAM to confirm raw board delamination.   

Victor,

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