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January 2009

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Subject:
From:
"Newland, Scott" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Newland, Scott
Date:
Tue, 13 Jan 2009 14:20:43 -0500
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We are suddenly seeing a rash of dull and grainy solder joints on SMT
inductors that use silver-palladium-platinum-glass frit terminations.
Otherwise the exterior of the joint looks good. The terminations as
supplied have no leaded or lead free solder or tin finish, just the
glass frit. In cross section the joint is also unique in that there is
no real IM layer and the grain structure near the joint is a bit odd.
The solder joints are fully re-flowed.  All the other solder joints on
the CCA look good with no indication of solder process issues.

 

The vendor claims they have been supplying this type of termination for
years and nothing has changed, also this issue has just sprung up in the
last couple of months.

 

As far as we can tell the joints look different, but reliable.

 

Any suggestions or comments?

 

Scott Newland

Chief Mechanical Engineer - Fighter Enterprise
Harris GCSD
321 768 4272 (W)
321 720 1756 (C)
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