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January 2009

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Subject:
Re: a question about assembly
From:
Rudolph yu <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Rudolph yu <[log in to unmask]>
Date:
Tue, 13 Jan 2009 05:12:04 +0000
Content-Type:
text/plain
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text/plain (16 lines) 
If you company owns the design, I would suggest that you ask the CAD group to add the heatsink outline on the PCB silkscreen for alignment.
 
Rudolph > Date: Tue, 13 Jan 2009 10:55:32 +0800> From: [log in to unmask]> Subject: [TN] a question about assembly> To: [log in to unmask]> > Is it necessary that heatsink and BGA be centre alignment?> > And how you assure that be executed?> > > > > Hecong> > > ---------------------------------------------------> Technet Mail List provided as a service by IPC using LISTSERV 15.0> To unsubscribe, send a message to [log in to unmask] with following text in> the BODY (NOT the subject field): SIGNOFF Technet> To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)> To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest> Search the archives of previous posts at: http://listserv.ipc.org/archives> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815> -----------------------------------------------------
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