Hello,
Does anyone know of a current standard for the generation of solder
paste stencil apertures? I know the general rule is 10% less than the
copper pad. We use PCB Libraries design guides here for all our symbol
generation but I don't think it supports "window paning" or "home plate"
type apertures. We currently have been leaving the special aperture
generation up to our stencil vendor and review the results prior to
release for manufacture.  There has been some talk here about
incorporating those apertures in the actual PADS PCB file which is why I
am asking about standards.
 
Thanks,
 
Dave Connitt CID+
Printed Circuit Designer
L3 Fuzing & Ordnance Systems
A Wholly Owned Subsidiary of:
L3 Communications
3975 McMann Road
Cincinnati, Ohio 45245
Ph. 513- 943-2010   Fax 513-943-2288

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