TECHNET Archives

January 2009

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Reply To:
Date:
Fri, 30 Jan 2009 15:58:56 +0530
Content-Type:
text/plain
Parts/Attachments:
text/plain (22 lines)
Dear All,
We have horizontal loading plasma Etch machine.We would like to know the process parameters for the machine to get unifrom etch back effect.
Is the gas mixture recipe & temparature same for the vertical and horizontal loading machines.
Any tips on getting good etch back effect are welcome.The applicaion is for high Tg material more than 170.
Please suggest.
Thanks in advance for your reply.
Regards
Suresh

-------------------------------
Micropack Ltd, Bangalore, India

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2