That's what we're assuming as one of the biggest reasons.

But I've still questioned there's other important reason we must know.



Regarding one of the surface finish options for contact pad,

JEDEC recommends like below.





JEDEC ---------

Recommended plating for contact pad



 - Ni 2um(min) , Au 0.762um(min) 



 - Ni ?, Au 0.05~0.75um with 'corrosive barrier lubricant'

---------





Based on the JEDEC recommendation above, 

can we suggest our customer(set makers) for instance Au 0.5um with 'corrosive barrier lubricant' for contact pad finish?? 

- Of course suggested with some data which shows good reliability result. 







  ----- Original Message ----- 

  From: Joyce Koo 

  To: [log in to unmask] 

  Sent: Thursday, January 29, 2009 6:47 PM

  Subject: Re: [TN] NiAu plating on tab pad





  Based on the established reliability results years ago.  

  --------------------------

  Sent using BlackBerry





  ----- Original Message -----

  From: TechNet <[log in to unmask]>

  To: [log in to unmask] <[log in to unmask]>

  Sent: Thu Jan 29 02:40:54 2009

  Subject: [TN] NiAu plating on tab pad





  Hello Techneters,



  I want to know why do we have to do e'lytic Ni/Au plating on tab pad of memory module PCBs.

  I mean why specified surface finish and why specified 'gold' thickness.

  (mostly specified by set makers. Industry standards like IPC and JEDEC seems to just recommends.) 



  If Ni/Au plating with reduced thickness or other finishes can meet mechanical/reliability requirement in their socketing application,

  isn't it okay to use?



  Is there any siginificant reason in using e'lytic Ni/Au plating with specified thickness??



  Thanks for the kind answer in advance.

  Good day!



  jc



  Korea Circuit R&D



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