Dear Technetters and Designers,
 
A question to resolve apparent conflict between the above IPCs.
 
As an example, take a 14 layer (4R+6F+4R) flex-rigid design 1.8mm thick
with polyimide/glass laminates and pre-preg used in rigid portions.
 
From IPC-2223A Table 4-2 Subnote (1) I would assume as <10% Low Tg
Laminate, the example would qualify as a Type 4(1), therefore requiring
Minimum Average Copper Thickness of 25um [984uim]. There is no Class
1,2,3 distinction.
 
But, IPC-6013B Table 1-1 Hole Plating for Type 4 > 6 layers Min.Ave
Copper for Class 3 calls for 35um [0.00138in]. This conflicts with
IPC-2223A Table 4-2 for a Type 4(1) Flex-rigid PCB and IPC-6013B Table
1-1 does not make distinction for amount of Low Tg material in build.
 
Could you help in understanding if I am missing something? Which should
be taken as "bottom line" - the design standard IPC-2223A or the
Qualification and Performance spec IPC-6013B for a high-rel application?
 
Thanks for your advice in advance.
 
Phil.
 
 

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