Hello Techneters,



I want to know why do we have to do e'lytic Ni/Au plating on tab pad of memory module PCBs.

I mean why specified surface finish and why specified 'gold' thickness.

(mostly specified by set makers. Industry standards like IPC and JEDEC seems to just recommends.) 



If Ni/Au plating with reduced thickness or other finishes can meet mechanical/reliability requirement in their socketing application,

isn't it okay to use?



Is there any siginificant reason in using e'lytic Ni/Au plating with specified thickness??



Thanks for the kind answer in advance.

Good day!



jc



Korea Circuit R&D