A variety of registration options are available to meet every need. Register by March 16, 2009 and SAVE 25%!



Fine lined? Multilayered? Highly dense with IC packages on top? Flex offers an array of choices with a growing number of benefits. For managing high temperatures successfully, reducing weight and space and saving on assembly costs, flex can be the answer you've been searching for. Learn about new manufacturing technologies, high density flex and applications at the IPC International Conference on Flexible Circuits being held April 21-23, 2009, in Minneapolis, Minn.



Location & Hotel Accommodations

Holiday Inn Bloomington I-35W
1201 W. 94th Street
Bloomington, MN 55431
952-884-8211
IPC rate: $89.00
Cutoff date: April 6, 2009

Hurry and register today!  www.ipc.org/Flex-Conference-2009<http://www.ipc.org/Flex-Conference-2009>

Michelle Michelotti
Coordinator, Professional Development
IPC - Association Connecting Electronics Industries
3000 Lakeside Drive
Suite 309 S
Bannockburn, IL 60015-1249 USA
+1 847-597-2822
+1 847-615-5622
[log in to unmask]<mailto:[log in to unmask]>
www.ipc.org<http://www.ipc.org>

[cid:[log in to unmask]]<http://www.ipc.org/calendar/2009/IPC-JEDECLF03.04.09/LFSantaClara0309.htm>





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