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January 2009

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Subject:
From:
Kevin Glidden <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Kevin Glidden <[log in to unmask]>
Date:
Tue, 6 Jan 2009 14:29:50 -0500
Content-Type:
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Applying heat evenly to both sides helps prevent board warping.  If the
board is warped even a little during solder joint formation, when it cools
the joints will be under stress and possibly lead to cracks, etc.

Kevin Glidden
Manufacturing Engineer
Luminescent Systems Inc.


-----Original Message-----
From: Eli Sarig [mailto:[log in to unmask]] 
Sent: Tuesday, January 06, 2009 2:16 PM
To: [log in to unmask]
Subject: [TN] Question about bottom heaters of reflow oven

Hi all,

My question is related to the necessity of down heaters in the reflow oven.
When we solder double sided boards, we *can* create a suitable reflow
profile using *only* the top heaters of the oven.
In that case, the bottom heaters remain at room temperature. We measure
almost the same temperature on top and bottom of the board.
Are there any limitations or problems that might happen using this kind of
process?

Thanks,

Eli.

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