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January 2009

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Subject:
From:
Brian Ellis <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Brian Ellis <[log in to unmask]>
Date:
Thu, 22 Jan 2009 09:09:24 +0200
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Send them back. Absolutely unacceptable. In time, they could become 
pockets of water if the lack of adhesion was caused by a hygroscopic 
contaminant.

Brian

Roberts, Jon wrote:
> Have any of you had bare board (PWB rigid flex) with what appears to
> have bubbles on the outer surface of the rigid board?  The bubbles will
> also be under where the solder mask is placed.  I have pictures if
> someone will refresh me on who to send to be available to the TechNet
> group, Thanks, Jon
> 
> 
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