We modified a stencil cleaner to clean misprints. We clean, dry and reprint.
We discussed paste print acceptance criteria in a J-STD committee meeting
once. It did not get very far.
I think that Bob Willis has nice acceptance criteria.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Leland Woodall
Sent: Wednesday, January 21, 2009 10:57 AM
To: [log in to unmask]
Subject: [TN] Automated Solder Paste Inspection - Best Practices Request
Technetters,
I sent this out last week during a period of nasty weather across the
country, and of course, got limited responses. I'm trying it again, as this
is quite important.
Please help me if you can.
Thanks!
Leland
-----Original Message-----
From: Leland Woodall
Sent: Thursday, January 15, 2009 2:40 PM
To: 'TechNet E-Mail Forum'
Subject: Automated Solder Paste Inspection - Best Practices Request
Everyone,
We have automated solder paste inspection machines immediately following
each of our screen printers. These all check for volume, height, and pad
coverage. We run only lead-free products, and also have a requirement that
disallows any wiping or cleaning of a misprinted board.
I'm looking for folks running a similar operation that can give me some
recommendations on how they manage this process. How many bridges do you
allow? How do you handle insufficients or inadequate pad coverage?
Insufficient paste volume bothers me, as I'm always afraid our post-reflow
AOI process will not detect the condition. I also hate to scrap a board
that has only a couple of pads with low or no solder.
Any suggestions on how we can minimize scrap but ensure we have no escapes?
Do we write down the effected pads, mark the board, place the parts, and
capture it after the oven? How could one reliably manage this?
Your comments are sincerely appreciated.
Stay warm!
Leland Woodall
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