Technetters,

I sent this out last week during a period of nasty weather across the
country, and of course, got limited responses.  I'm trying it again, as
this is quite important.

Please help me if you can.

Thanks!

Leland

-----Original Message-----
From: Leland Woodall 
Sent: Thursday, January 15, 2009 2:40 PM
To: 'TechNet E-Mail Forum'
Subject: Automated Solder Paste Inspection - Best Practices Request

Everyone,

We have automated solder paste inspection machines immediately following
each of our screen printers.  These all check for volume, height, and
pad coverage.  We run only lead-free products, and also have a
requirement that disallows any wiping or cleaning of a misprinted board.

I'm looking for folks running a similar operation that can give me some
recommendations on how they manage this process.  How many bridges do
you allow?  How do you handle insufficients or inadequate pad coverage?

Insufficient paste volume bothers me, as I'm always afraid our
post-reflow AOI process will not detect the condition.  I also hate to
scrap a board that has only a couple of pads with low or no solder.

Any suggestions on how we can minimize scrap but ensure we have no
escapes?  Do we write down the effected pads, mark the board, place the
parts, and capture it after the oven?  How could one reliably manage
this?

Your comments are sincerely appreciated.

Stay warm!

Leland Woodall
 

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