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Subject:
Re: Possible cause on open
From:
Graham Naisbitt <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Graham Naisbitt <[log in to unmask]>
Date:
Tue, 20 Jan 2009 22:07:21 +0000
Content-Type:
text/plain
Parts/Attachments:
text/plain (620 lines) 
THAT is a contradiction in terms!

On 20 Jan 2009, at 19:33, John Burke wrote:

> Inge - I am English........
>
> But I do live in California!!!
>
> John Burke
> (408) 515 4992
>
>
> -----Original Message-----
> From: Inge [mailto:[log in to unmask]]
> Sent: Tuesday, January 20, 2009 9:48 AM
> To: TechNet E-Mail Forum; John Burke
> Subject: Re: [TN] Possible cause on open
>
> John, what kind of a american are you? Thought all of you were 100%  
> occupied
>
> by the installation of the new leader? Anyway, my warmest
> congratulations..new hope, new intentions, new decisions etc,
> Ciao
> Inge
> ----- Original Message -----
> From: "John Burke" <[log in to unmask]>
> To: <[log in to unmask]>
> Sent: Tuesday, January 20, 2009 6:16 PM
> Subject: Re: [TN] Possible cause on open
>
>
>> The chicken crossed the freeway,
>> So black and so wide,
>> 'Cos he saw more gold on the other side,
>> Applied it to products as he saw fit,
>> And all he got was a pile of @@@@@
>>
>>
>> John Burke
>> (408) 515 4992
>>
>>
>> -----Original Message-----
>> From: TechNet [mailto:[log in to unmask]] On Behalf Of Whittaker, Dewey
>> (EHCOE)
>> Sent: Tuesday, January 20, 2009 5:50 AM
>> To: [log in to unmask]
>> Subject: Re: [TN] Possible cause on open
>>
>> John and Inge,
>> You two are like chickens crossing the road; poultry in motion.
>> Dewey
>>
>> -----Original Message-----
>> From: TechNet [mailto:[log in to unmask]] On Behalf Of Hernefjord  
>> Ingemar
>> Sent: Tuesday, January 20, 2009 2:10 AM
>> To: [log in to unmask]
>> Subject: Re: [TN] Possible cause on open
>>
>> the funuity level is such
>> originuity issue in touch
>> is more or less forgotten
>> when Dewity ponbow is tauten
>>
>> Inge
>>
>>
>> -----Original Message-----
>> From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke
>> Sent: tisdag 20 januari 2009 00:21
>> To: [log in to unmask]
>> Subject: Re: [TN] Possible cause on open
>>
>> If more than a flash of Au you seek
>> There is a bad future and here is a peek The experts here have showed
>> the way Ignore them and expect floods of RMA.
>>
>>
>> John Burke
>> (408) 515 4992
>>
>> -----Original Message-----
>> From: Whittaker, Dewey (EHCOE) [mailto:[log in to unmask]]
>> Sent: Monday, January 19, 2009 6:09 AM
>> To: TechNet E-Mail Forum; John Burke
>> Subject: RE: [TN] Possible cause on open
>>
>> Although your response was timely, mine was more winely.
>> I was referring to the finish with complex overtones of my  
>> intoxicating
>> humor. If you were expecting gold flash, but got a substantial (50
>> micro-inches) amount of hard gold, that could be problematic.
>>
>> So allow me to be so bold
>> To warn of all that gold
>> At times it offers entitlement
>> And others just embrittlement.
>>
>> Dewey
>>
>>
>> -----Original Message-----
>> From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke
>> Sent: Friday, January 16, 2009 2:49 PM
>> To: [log in to unmask]
>> Subject: Re: [TN] Possible cause on open
>>
>> As in Rolex?
>>
>> John Burke
>> (408) 515 4992
>>
>> -----Original Message-----
>> From: TechNet [mailto:[log in to unmask]] On Behalf Of Whittaker, Dewey
>> (EHCOE)
>> Sent: Friday, January 16, 2009 11:44 AM
>> To: [log in to unmask]
>> Subject: Re: [TN] Possible cause on open
>>
>> Augh! You can never have too much Au, unless it's more flash than
>> substance.
>> Dewey
>>
>> -----Original Message-----
>> From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner engelmaier
>> Sent: Friday, January 16, 2009 12:35 PM
>> To: [log in to unmask]
>> Subject: Re: [TN] Possible cause on open
>>
>>
>> Hi richard,
>> where do these PCBs come from? Not everything called ENIG is in fact
>> immersion Au--thus, you can have too m uch Au.
>>
>> Werner
>> Future workshops:
>> Pb-Free Soldering Processes: Survival, Quality, Reliability- 
>> PROBLEMS &
>> SOLUTIONS, March 3, IPC/JEDEC Santa Clara, CA Solder Joint  
>> Reliability:
>> Part 1-Solder Joint Reliability Fundamentals, March 29, IPC EXPO/APEX
>> Las Vegas Pb-Free Soldering Processes: Survival, Quality,  
>> Reliability:
>> PROBLEMS & SOLUTIONS, March 30, IPC EXPO/APEX Las Vegas
>>
>>
>>
>>
>>
>>
>>
>>
>> -----Original Message-----
>> From: Thayer, Wayne <[log in to unmask]>
>> To: [log in to unmask]
>> Sent: Fri, 16 Jan 2009 11:02 am
>> Subject: Re: [TN] Possible cause on open
>>
>>
>>
>>
>>
>>
>>
>>
>>
>>
>> My vote says this is not ENIG--it is ENEG!
>>
>> -----Original Message-----
>> From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard  
>> D.
>> Sent: Friday, January 16, 2009 10:48 AM
>> To: [log in to unmask]
>> Subject: Re: [TN] Possible cause on open
>>
>> I expanded the images and I am sending them back to Steve for
>> re-posting. I can see a lot of flower-petal patterns, a lot of rod  
>> and
>> cone structures just above the IMC. It appears as if there are very
>> heavy gold intermetallics along the top of the IMC, and the gold
>> nucleated back towards the IMC from the solder ball.
>> The IMC layer is very thin.
>> The solder between the edge of the soldermask and the edge of the pad
>> causes the pad edge to look like they curled at the edges, but I  
>> think
>> you can see that it is just the crack curling downwards inside of the
>> sol der. Full reflow obviously took place because the solder melted  
>> down
>> the sides of the pads and filled the space between the soldermask and
>> the curled edges of the pad. In the image taken near the center of  
>> the
>> pad, it is obvious the crack propogated through the solder in some
>> areas.
>> The crack along the entire length of the pad and down the sides
>> indicates severe stresses due to either the vibration forces or the  
>> CTE
>> from the temperature cycling, or both. The crack probably formed  
>> due to
>> the brittle nature of the IMF, what with having the worst possible
>> combination of ENIG, lead-free solder, and lateral stresses. There  
>> are
>> some voids with flux debris above the whole thing that tend to  
>> confuse
>> the issues going on.
>> Steve, I am sending my expanded image to you for posting separately.
>> Thanks.
>> Richard
>>
>> -----Original Message-----
>> From: TechNet [mailto:[log in to unmask]] On Behalf Of Igoshev, Vladimir
>> Sent: Thursday, January 15, 2009 8:42 PM
>> To: [log in to unmask]
>> Subject: Re: [TN] Possible cause on open
>>
>> Thank you for sending me the image. Honestly, I don't quite  
>> understand
>> what I see. The finish doesn't look like ENIG and the cavity above
>> something that DOES NOT look like a typical intermetallic shouldn't  
>> be
>> there, not to mention a "hair-like" something (crack?????) above the
>> cavity.
>>
>> It looks like a proper joint had never been formed. Can you ask the  
>> lab
>> to slightly etch the section?
>>
>> Regards,
>>
>> Vladimir
>>
>> ________________________________
>>
>> From: Tan Geok Ang
>> To: Igoshev, Vladimir; TechNet@IP
>> C.ORG
>> Sent: Thu Jan 15 20:09:33 2009
>> Subject: RE: [TN] Possible cause on open
>>
>>
>> About 1.05um
>>
>>
>>
>> ________________________________
>>
>> From: Igoshev, Vladimir [mailto:[log in to unmask]]
>> Sent: Friday, 16 January 2009 9:01 AM
>> To: Tan Geok Ang; [log in to unmask]
>> Subject: Re: [TN] Possible cause on open
>>
>>
>>
>> The info I'm asking about is at the bottom of the images you sent to
>> Steve. You should be able to read from the originals what it says  
>> (how
>> many
>> microns)
>>
>> Regards,
>>
>> Vladimir
>>
>> ----- Original Message -----
>> From: Tan Geok Ang <[log in to unmask]>
>> To: TechNet E-Mail Forum <[log in to unmask]>; Igoshev, Vladimir
>> Sent: Thu Jan 15 19:53:13 2009
>> Subject: RE: [TN] Possible cause on open
>>
>> The service lab has not come out much information at this time. Will
>> input you once I have the information. Thank you.
>>
>> -----Original Message-----
>> From: TechNet [mailto:[log in to unmask]] On Behalf Of Igoshev, Vladimir
>> Sent: Thursday, 15 January 2009 10:50 PM
>> To: [log in to unmask]
>> Subject: Re: [TN] Possible cause on open
>>
>> It looks like there could be something fishy in the intermetallic  
>> layer.
>> GA, can you tell me please what is the reading on the micron bars?
>>
>> Regards,
>>
>> Vladimir
>>
>> -----Original Message-----
>> From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory
>> Sent: Thursday, January 15, 2009 8:05 AM
>> To: [log in to unmask]
>> Subject: Re: [TN] Possible cause on open
>>
>> Mornin' Everbody!
>>
>> Well, here in Tulsa, we're just like a lot of other people in the
>> country this morning, trying to stay warm. Right now we're sitting at
>> -10 C. with a wind chill of -15 C. It's supposed to be colder
>> tomorrow...
>>
>> GA, I have your pictures posted now. They're at:
>>
>> http://stevezeva.homestead.com/files/Fracture1.jpg
>>
>> http://stevezeva.homestead.com/files/Fracture2.jpg
>>
>> Hopefully someone can give you some ideas...
>>
>> Steve
>>
>>
>> ________________________________
>>
>> From: Tan Geok Ang [mailto:[log in to unmask]]
>> Sent: Wednesday, January 14, 2009 7:27 PM
>> To: [log in to unmask]; Steve Gregory
>> Subject: Possible cause on open
>>
>>
>>
>> Hi Steve,
>>
>>           Please help to download these pictures TechNet, thanks.
>>
>>
>>
>>
>>
>>
>>
>> Hi All experts,
>>
>>           Testing (combine test of 16G at 85 oC) was performed on
>> evaluation boards with under-filled BGAs. Open issue (cracks) was
>> detected only at some corners of the BGA (35x35mm with 1156 balls)  
>> after
>> the test. Lead-free process and PCB with ENIG surface finish. Peak
>> temperature is 248 oC with a 65 sec above
>> 217 oC.
>>
>> FYI, the service lab has not come out a report.
>>
>>           What are the possible causes? (CET mismatches, Lead-free
>> alloy related, material, processes)
>>
>>
>>
>>           Thank you in advance.
>>
>>
>>
>> Regards
>>
>> GA Tan
>>
>>
>>
>>
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