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January 2009

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Subject:
Re: Possible cause on open
From:
Graham Naisbitt <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Graham Naisbitt <[log in to unmask]>
Date:
Tue, 20 Jan 2009 14:00:15 +0000
Content-Type:
text/plain
Parts/Attachments:
text/plain (518 lines) 
How do I get away from this?????

On 20 Jan 2009, at 13:50, Whittaker, Dewey (EHCOE) wrote:

> John and Inge,
> You two are like chickens crossing the road; poultry in motion.
> Dewey
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Hernefjord Ingemar
> Sent: Tuesday, January 20, 2009 2:10 AM
> To: [log in to unmask]
> Subject: Re: [TN] Possible cause on open
>
> the funuity level is such
> originuity issue in touch
> is more or less forgotten
> when Dewity ponbow is tauten
>
> Inge
>
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke
> Sent: tisdag 20 januari 2009 00:21
> To: [log in to unmask]
> Subject: Re: [TN] Possible cause on open
>
> If more than a flash of Au you seek
> There is a bad future and here is a peek The experts here have showed
> the way Ignore them and expect floods of RMA.
>
>
> John Burke
> (408) 515 4992
>
> -----Original Message-----
> From: Whittaker, Dewey (EHCOE) [mailto:[log in to unmask]]
> Sent: Monday, January 19, 2009 6:09 AM
> To: TechNet E-Mail Forum; John Burke
> Subject: RE: [TN] Possible cause on open
>
> Although your response was timely, mine was more winely.
> I was referring to the finish with complex overtones of my  
> intoxicating
> humor. If you were expecting gold flash, but got a substantial (50
> micro-inches) amount of hard gold, that could be problematic.
>
> So allow me to be so bold
> To warn of all that gold
> At times it offers entitlement
> And others just embrittlement.
>
> Dewey
>
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke
> Sent: Friday, January 16, 2009 2:49 PM
> To: [log in to unmask]
> Subject: Re: [TN] Possible cause on open
>
> As in Rolex?
>
> John Burke
> (408) 515 4992
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Whittaker, Dewey
> (EHCOE)
> Sent: Friday, January 16, 2009 11:44 AM
> To: [log in to unmask]
> Subject: Re: [TN] Possible cause on open
>
> Augh! You can never have too much Au, unless it's more flash than
> substance.
> Dewey
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner engelmaier
> Sent: Friday, January 16, 2009 12:35 PM
> To: [log in to unmask]
> Subject: Re: [TN] Possible cause on open
>
>
> Hi richard,
> where do these PCBs come from? Not everything called ENIG is in fact
> immersion Au--thus, you can have too m uch Au.
>
> Werner
> Future workshops:
> Pb-Free Soldering Processes: Survival, Quality, Reliability-PROBLEMS &
> SOLUTIONS, March 3, IPC/JEDEC Santa Clara, CA Solder Joint  
> Reliability:
> Part 1-Solder Joint Reliability Fundamentals, March 29, IPC EXPO/APEX
> Las Vegas Pb-Free Soldering Processes: Survival, Quality, Reliability:
> PROBLEMS & SOLUTIONS, March 30, IPC EXPO/APEX Las Vegas
>
>
>
>
>
>
>
>
> -----Original Message-----
> From: Thayer, Wayne <[log in to unmask]>
> To: [log in to unmask]
> Sent: Fri, 16 Jan 2009 11:02 am
> Subject: Re: [TN] Possible cause on open
>
>
>
>
>
>
>
>
>
>
> My vote says this is not ENIG--it is ENEG!
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.
> Sent: Friday, January 16, 2009 10:48 AM
> To: [log in to unmask]
> Subject: Re: [TN] Possible cause on open
>
> I expanded the images and I am sending them back to Steve for
> re-posting. I can see a lot of flower-petal patterns, a lot of rod and
> cone structures just above the IMC. It appears as if there are very
> heavy gold intermetallics along the top of the IMC, and the gold
> nucleated back towards the IMC from the solder ball.
> The IMC layer is very thin.
> The solder between the edge of the soldermask and the edge of the pad
> causes the pad edge to look like they curled at the edges, but I think
> you can see that it is just the crack curling downwards inside of the
> sol der. Full reflow obviously took place because the solder melted  
> down
> the sides of the pads and filled the space between the soldermask and
> the curled edges of the pad. In the image taken near the center of the
> pad, it is obvious the crack propogated through the solder in some
> areas.
> The crack along the entire length of the pad and down the sides
> indicates severe stresses due to either the vibration forces or the  
> CTE
> from the temperature cycling, or both. The crack probably formed due  
> to
> the brittle nature of the IMF, what with having the worst possible
> combination of ENIG, lead-free solder, and lateral stresses. There are
> some voids with flux debris above the whole thing that tend to confuse
> the issues going on.
> Steve, I am sending my expanded image to you for posting separately.
> Thanks.
> Richard
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Igoshev, Vladimir
> Sent: Thursday, January 15, 2009 8:42 PM
> To: [log in to unmask]
> Subject: Re: [TN] Possible cause on open
>
> Thank you for sending me the image. Honestly, I don't quite understand
> what I see. The finish doesn't look like ENIG and the cavity above
> something that DOES NOT look like a typical intermetallic shouldn't be
> there, not to mention a "hair-like" something (crack?????) above the
> cavity.
>
> It looks like a proper joint had never been formed. Can you ask the  
> lab
> to slightly etch the section?
>
> Regards,
>
> Vladimir
>
> ________________________________
>
> From: Tan Geok Ang
> To: Igoshev, Vladimir; TechNet@IP
> C.ORG
> Sent: Thu Jan 15 20:09:33 2009
> Subject: RE: [TN] Possible cause on open
>
>
> About 1.05um
>
>
>
> ________________________________
>
> From: Igoshev, Vladimir [mailto:[log in to unmask]]
> Sent: Friday, 16 January 2009 9:01 AM
> To: Tan Geok Ang; [log in to unmask]
> Subject: Re: [TN] Possible cause on open
>
>
>
> The info I'm asking about is at the bottom of the images you sent to
> Steve. You should be able to read from the originals what it says (how
> many
> microns)
>
> Regards,
>
> Vladimir
>
> ----- Original Message -----
> From: Tan Geok Ang <[log in to unmask]>
> To: TechNet E-Mail Forum <[log in to unmask]>; Igoshev, Vladimir
> Sent: Thu Jan 15 19:53:13 2009
> Subject: RE: [TN] Possible cause on open
>
> The service lab has not come out much information at this time. Will
> input you once I have the information. Thank you.
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Igoshev, Vladimir
> Sent: Thursday, 15 January 2009 10:50 PM
> To: [log in to unmask]
> Subject: Re: [TN] Possible cause on open
>
> It looks like there could be something fishy in the intermetallic  
> layer.
> GA, can you tell me please what is the reading on the micron bars?
>
> Regards,
>
> Vladimir
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory
> Sent: Thursday, January 15, 2009 8:05 AM
> To: [log in to unmask]
> Subject: Re: [TN] Possible cause on open
>
> Mornin' Everbody!
>
> Well, here in Tulsa, we're just like a lot of other people in the
> country this morning, trying to stay warm. Right now we're sitting at
> -10 C. with a wind chill of -15 C. It's supposed to be colder
> tomorrow...
>
> GA, I have your pictures posted now. They're at:
>
> http://stevezeva.homestead.com/files/Fracture1.jpg
>
> http://stevezeva.homestead.com/files/Fracture2.jpg
>
> Hopefully someone can give you some ideas...
>
> Steve
>
>
> ________________________________
>
> From: Tan Geok Ang [mailto:[log in to unmask]]
> Sent: Wednesday, January 14, 2009 7:27 PM
> To: [log in to unmask]; Steve Gregory
> Subject: Possible cause on open
>
>
>
> Hi Steve,
>
>            Please help to download these pictures TechNet, thanks.
>
>
>
>
>
>
>
> Hi All experts,
>
>            Testing (combine test of 16G at 85 oC) was performed on
> evaluation boards with under-filled BGAs. Open issue (cracks) was
> detected only at some corners of the BGA (35x35mm with 1156 balls)  
> after
> the test. Lead-free process and PCB with ENIG surface finish. Peak
> temperature is 248 oC with a 65 sec above
> 217 oC.
>
> FYI, the service lab has not come out a report.
>
>            What are the possible causes? (CET mismatches, Lead-free
> alloy related, material, processes)
>
>
>
>            Thank you in advance.
>
>
>
> Regards
>
> GA Tan
>
>
>
>
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