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January 2009

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Subject:
Re: Resin Recession
From:
Werner engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Werner engelmaier <[log in to unmask]>
Date:
Fri, 16 Jan 2009 14:30:47 -0500
Content-Type:
text/plain
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text/plain (82 lines) 
 Hi Pradeep,
How do you define "maximum allowable resin recession of 10%"--10% of what?
Resin recession is much more design related [Cu plating thickness, distance between innerlayer lands, resin content, degree of resin cure] than processing related.
You can get that by plating thick Cu, keeping all lands [functional and non-functional] and laminate as resin-poor as possible,

Werner



 

-----Original Message-----
From: mp3 <[log in to unmask]>
To: [log in to unmask]
Sent: Fri, 16 Jan 2009 12:55 am
Subject: [TN] Resin Recession










Dear all,

As per IPC 600G 3.1.9, resin recession after thermal stress is not considered as 
a defect for all classes of boards unless specified in the procurement document. 
We have a high reliability customer who requires 3 times thermal stress ( 3 
cycles of solder dip for 10 secs at 288 deg C) to be done, with a maximum 
allowable resin recession of 10%. We find this to be extremely stiff . Can 
anybody provide us a feedback on this and any suggestions to achieve this.

Rgds,

Pradeep.M
Assistant General Manager
Micropack Limited
Plot#16, Jigani Industrial Area,
Anekal Taluk, Bangalore - 562 106
India
Tel : 91 80 27825223 / 27825224
Fax : 91 80 27825225
email : [log in to unmask]
visit us @ www.micro-pack.com



-------------------------------
Micropack Ltd, Bangalore, India

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