Hi all,
My question is related to the necessity of down heaters in the reflow oven.
When we solder double sided boards, we *can* create a suitable reflow
profile using *only* the top heaters of the oven.
In that case, the bottom heaters remain at room temperature. We measure
almost the same temperature on top and bottom of the board.
Are there any limitations or problems that might happen using this kind of
process?
Thanks,
Eli.
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