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January 2009

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Subject:
Moisture Content of PWB's for Assembly?
From:
Matt Byrne <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Matt Byrne <[log in to unmask]>
Date:
Tue, 13 Jan 2009 07:36:27 -0600
Content-Type:
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I'm looking for a target measured level of moisture in epxoy/plass PWB's before 
soldering assembly.  Baking before assembly is used to remove moisture, but 
what's considered "safe" to avoid excess z-axis expansion?

I found mention of 0.5% moisture in the resin in an archived TechNet note.

Any hard data out there?


MB

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