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Date: | Wed, 7 Jan 2009 09:04:47 -0600 |
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Dave,
Making those decisions from the PCB design or stencil manufacturing side is
really backwards. That's really up to assembly engineerring. The 10% rule is
just a starting point. And multiple CMs might want their own shapes, based on
their equipment/processses.
We have talked about adding special stencils to our PADS library for years, but
even with our own captive assembly, haven't come up with enough "standard"
modifications to make it worthwhile. We might do just a few that get modified
the same every time. The new mask adjust attributes Mentor added in v2007
make it tempting for the PCB guys to engineer that, too, but that only allows
for a same shape reduction/expansion. They're probably most useful only for
unique BGA, fine pitch, or via solder mask apertures.
Even a control freak like myself doesn't want to take on that part of the job!
Pete
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