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January 2009

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Subject:
From:
Ioan Tempea <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ioan Tempea <[log in to unmask]>
Date:
Wed, 7 Jan 2009 08:04:56 -0500
Content-Type:
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Dave,

The 10% rule won't get you far. You want to purchase IPC-7525A.

Regards,

Ioan Tempea, ing.
t : 450-967-7100 ext : 244
[log in to unmask]
www.digico.cc
P N'imprimer que si nécessaire - Print only if you must
-----Message d'origine-----
De : TechNet [mailto:[log in to unmask]] De la part de Dave Connitt
Envoyé : 7 janvier 2009 06:59
À : [log in to unmask]
Objet : [TN] Solder Paste Stencil Guidelines

Hello,
Does anyone know of a current standard for the generation of solder
paste stencil apertures? I know the general rule is 10% less than the
copper pad. We use PCB Libraries design guides here for all our symbol
generation but I don't think it supports "window paning" or "home plate"
type apertures. We currently have been leaving the special aperture
generation up to our stencil vendor and review the results prior to
release for manufacture.  There has been some talk here about
incorporating those apertures in the actual PADS PCB file which is why I
am asking about standards.
 
Thanks,
 
Dave Connitt CID+
Printed Circuit Designer
L3 Fuzing & Ordnance Systems
A Wholly Owned Subsidiary of:
L3 Communications
3975 McMann Road
Cincinnati, Ohio 45245
Ph. 513- 943-2010   Fax 513-943-2288

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