The chicken crossed the freeway,
So black and so wide,
'Cos he saw more gold on the other side,
Applied it to products as he saw fit,
And all he got was a pile of @@@@@
John Burke
(408) 515 4992
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Whittaker, Dewey (EHCOE)
Sent: Tuesday, January 20, 2009 5:50 AM
To: [log in to unmask]
Subject: Re: [TN] Possible cause on open
John and Inge,
You two are like chickens crossing the road; poultry in motion.
Dewey
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Hernefjord Ingemar
Sent: Tuesday, January 20, 2009 2:10 AM
To: [log in to unmask]
Subject: Re: [TN] Possible cause on open
the funuity level is such
originuity issue in touch
is more or less forgotten
when Dewity ponbow is tauten
Inge
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke
Sent: tisdag 20 januari 2009 00:21
To: [log in to unmask]
Subject: Re: [TN] Possible cause on open
If more than a flash of Au you seek
There is a bad future and here is a peek The experts here have showed
the way Ignore them and expect floods of RMA.
John Burke
(408) 515 4992
-----Original Message-----
From: Whittaker, Dewey (EHCOE) [mailto:[log in to unmask]]
Sent: Monday, January 19, 2009 6:09 AM
To: TechNet E-Mail Forum; John Burke
Subject: RE: [TN] Possible cause on open
Although your response was timely, mine was more winely.
I was referring to the finish with complex overtones of my intoxicating
humor. If you were expecting gold flash, but got a substantial (50
micro-inches) amount of hard gold, that could be problematic.
So allow me to be so bold
To warn of all that gold
At times it offers entitlement
And others just embrittlement.
Dewey
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke
Sent: Friday, January 16, 2009 2:49 PM
To: [log in to unmask]
Subject: Re: [TN] Possible cause on open
As in Rolex?
John Burke
(408) 515 4992
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Whittaker, Dewey
(EHCOE)
Sent: Friday, January 16, 2009 11:44 AM
To: [log in to unmask]
Subject: Re: [TN] Possible cause on open
Augh! You can never have too much Au, unless it's more flash than
substance.
Dewey
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner engelmaier
Sent: Friday, January 16, 2009 12:35 PM
To: [log in to unmask]
Subject: Re: [TN] Possible cause on open
Hi richard,
where do these PCBs come from? Not everything called ENIG is in fact
immersion Au--thus, you can have too m uch Au.
Werner
Future workshops:
Pb-Free Soldering Processes: Survival, Quality, Reliability-PROBLEMS &
SOLUTIONS, March 3, IPC/JEDEC Santa Clara, CA Solder Joint Reliability:
Part 1-Solder Joint Reliability Fundamentals, March 29, IPC EXPO/APEX
Las Vegas Pb-Free Soldering Processes: Survival, Quality, Reliability:
PROBLEMS & SOLUTIONS, March 30, IPC EXPO/APEX Las Vegas
-----Original Message-----
From: Thayer, Wayne <[log in to unmask]>
To: [log in to unmask]
Sent: Fri, 16 Jan 2009 11:02 am
Subject: Re: [TN] Possible cause on open
My vote says this is not ENIG--it is ENEG!
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.
Sent: Friday, January 16, 2009 10:48 AM
To: [log in to unmask]
Subject: Re: [TN] Possible cause on open
I expanded the images and I am sending them back to Steve for
re-posting. I can see a lot of flower-petal patterns, a lot of rod and
cone structures just above the IMC. It appears as if there are very
heavy gold intermetallics along the top of the IMC, and the gold
nucleated back towards the IMC from the solder ball.
The IMC layer is very thin.
The solder between the edge of the soldermask and the edge of the pad
causes the pad edge to look like they curled at the edges, but I think
you can see that it is just the crack curling downwards inside of the
sol der. Full reflow obviously took place because the solder melted down
the sides of the pads and filled the space between the soldermask and
the curled edges of the pad. In the image taken near the center of the
pad, it is obvious the crack propogated through the solder in some
areas.
The crack along the entire length of the pad and down the sides
indicates severe stresses due to either the vibration forces or the CTE
from the temperature cycling, or both. The crack probably formed due to
the brittle nature of the IMF, what with having the worst possible
combination of ENIG, lead-free solder, and lateral stresses. There are
some voids with flux debris above the whole thing that tend to confuse
the issues going on.
Steve, I am sending my expanded image to you for posting separately.
Thanks.
Richard
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Igoshev, Vladimir
Sent: Thursday, January 15, 2009 8:42 PM
To: [log in to unmask]
Subject: Re: [TN] Possible cause on open
Thank you for sending me the image. Honestly, I don't quite understand
what I see. The finish doesn't look like ENIG and the cavity above
something that DOES NOT look like a typical intermetallic shouldn't be
there, not to mention a "hair-like" something (crack?????) above the
cavity.
It looks like a proper joint had never been formed. Can you ask the lab
to slightly etch the section?
Regards,
Vladimir
________________________________
From: Tan Geok Ang
To: Igoshev, Vladimir; TechNet@IP
C.ORG
Sent: Thu Jan 15 20:09:33 2009
Subject: RE: [TN] Possible cause on open
About 1.05um
________________________________
From: Igoshev, Vladimir [mailto:[log in to unmask]]
Sent: Friday, 16 January 2009 9:01 AM
To: Tan Geok Ang; [log in to unmask]
Subject: Re: [TN] Possible cause on open
The info I'm asking about is at the bottom of the images you sent to
Steve. You should be able to read from the originals what it says (how
many
microns)
Regards,
Vladimir
----- Original Message -----
From: Tan Geok Ang <[log in to unmask]>
To: TechNet E-Mail Forum <[log in to unmask]>; Igoshev, Vladimir
Sent: Thu Jan 15 19:53:13 2009
Subject: RE: [TN] Possible cause on open
The service lab has not come out much information at this time. Will
input you once I have the information. Thank you.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Igoshev, Vladimir
Sent: Thursday, 15 January 2009 10:50 PM
To: [log in to unmask]
Subject: Re: [TN] Possible cause on open
It looks like there could be something fishy in the intermetallic layer.
GA, can you tell me please what is the reading on the micron bars?
Regards,
Vladimir
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory
Sent: Thursday, January 15, 2009 8:05 AM
To: [log in to unmask]
Subject: Re: [TN] Possible cause on open
Mornin' Everbody!
Well, here in Tulsa, we're just like a lot of other people in the
country this morning, trying to stay warm. Right now we're sitting at
-10 C. with a wind chill of -15 C. It's supposed to be colder
tomorrow...
GA, I have your pictures posted now. They're at:
http://stevezeva.homestead.com/files/Fracture1.jpg
http://stevezeva.homestead.com/files/Fracture2.jpg
Hopefully someone can give you some ideas...
Steve
________________________________
From: Tan Geok Ang [mailto:[log in to unmask]]
Sent: Wednesday, January 14, 2009 7:27 PM
To: [log in to unmask]; Steve Gregory
Subject: Possible cause on open
Hi Steve,
Please help to download these pictures TechNet, thanks.
Hi All experts,
Testing (combine test of 16G at 85 oC) was performed on
evaluation boards with under-filled BGAs. Open issue (cracks) was
detected only at some corners of the BGA (35x35mm with 1156 balls) after
the test. Lead-free process and PCB with ENIG surface finish. Peak
temperature is 248 oC with a 65 sec above
217 oC.
FYI, the service lab has not come out a report.
What are the possible causes? (CET mismatches, Lead-free
alloy related, material, processes)
Thank you in advance.
Regards
GA Tan
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