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January 2009

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TechNet E-Mail Forum <[log in to unmask]>, "McGlaughlin, Jeffrey A" <[log in to unmask]>
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Thu, 15 Jan 2009 09:13:22 -0800
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TechNet E-Mail Forum <[log in to unmask]>, "Wilson, Bob" <[log in to unmask]>
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"Wilson, Bob" <[log in to unmask]>
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Chapter 18 in the 5th edition pages 18.12 and 18.13:

Wiring demand 

Wd = Wc x å (in cm/cm² or in/in²)

Wd = wiring demand; Wc = wiring capacity; å = PCB Layout efficiency
 
 ***************************************
 Wire capacity

Wc = T x L/G (in cm/cm²  or in/in²)

T = number of traces per wiring channel or distance between two via pads
L = number of signal layers
G = wiring channel width or length between centers f via pads in T

What's the third one?

Bob Wilson
E/M Designer, CID+
SpectraSensors, Inc.
11027 Arrow Route
Rancho Cucamonga, CA 91730
(909) 948-4110
www.spectrasensors.com
www.ipc.org


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of McGlaughlin, Jeffrey A
Sent: Thursday, January 15, 2009 8:42 AM
To: [log in to unmask]
Subject: [TN] Wiring Density Calculations

Can someone please send me copies of the 3 calculations for wiring density/wiring demand from Mr. Coomb's PCB Handbook (chapter 19 of 6th Ed.) My copy is not available (has gone missing with an intern) at present .

TIA,

Jeffrey A McGlaughlin, CID
Engineering Designer
Battelle
505 King Ave
Columbus Ohio 43201-2693
Phone (614)424-7582




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