DESIGNERCOUNCIL Archives

January 2009

DesignerCouncil@IPC.ORG
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Sender:
DesignerCouncil <[log in to unmask]>
X-To:
Designers Council Forum <[log in to unmask]>, "Brooks, Bill" <[log in to unmask]>
Date:
Mon, 12 Jan 2009 10:15:22 -0800
Reply-To:
"(Designers Council Forum)" <[log in to unmask]>, "Dack.Kelly" <[log in to unmask]>
Subject:
Re: solder thickness after reflow for tol. stackup
From:
"Dack.Kelly" <[log in to unmask]>
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A<[log in to unmask]>
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