Henry,

"Apparently the plating committee and the enig suppliers have been looking at 
this and it is described as a bit of an epidemic and they are calling it a new 
phenomenon that could rival black pad. "

Applying the common sense test, if this is a phenomenon due to the ENiG/lead 
free wave, why is it new, only appearing now?  These processes have been in 
place for years, something has to have changed to start this epidemic.  (we 
could blame it on global warming!)  Black pad didn't start off small and spread 
into an epidemic.  It just was.

So, since the technology is stable, look at the process at the fabricator or 
assembler.

"We are seeing everything in spec from the board vendors (thickness/P 
content) "

Is this based on your testing or their reports?  I've got a report right here 
showing boards passing with flying colors, and independent microsections and 
XRF that tells a very different story.

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