Thanks Rex
Kind regards,
Joe
In a message dated 12/9/2008 4:06:06 A.M. Pacific Standard Time,
[log in to unmask] writes:
JCAA/JG-PP Lead-Free Solder Project:
Vibration Test
Boeing Electronics Materials and Processes Report - 582, Revision A
(EM/P-582, Rev. A)
Contract No: BM3419-01
Prepared for ITB, Inc.
January 9, 2006
I have this paper and others. They are in the public domain. I Googled the
title of the paper and ended up at http://www.acqp2.nasa.gov/ where there are
a multiplicity of papers on vibration results for differing packages and
differing alloys
Rex Waygood
Technical Manager
PartnerTech Poole Ltd
Benson Road
Poole
Dorset BH17 0RY
United Kingdom
Tel: +44 (0)1202 674333
Fax: +44 (0)1202 678028
DDI: +44 (0)1202 338222
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[log in to unmask]
www.PartnerTech.co.uk
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Deng, Peter (Shenzhen)
Sent: 09 December 2008 09:16
To: [log in to unmask]
Subject: Re: [LF] vibration testing of tin-lead and lead-free solder joints
Joseph,
Your kind to dig out the link is appreciated, I am interested in detail.
Thanks.
Regards / Peter Deng
D +86(0)755 2671 0624
M ( +86) 138 2876 8267
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Joe Fjelstad
Sent: 2008年12月9日 4:45
To: [log in to unmask]
Subject: [LF] vibration testing of tin-lead and lead-free solder joints
Greetings folks
Found this on the wires today... (Cut it earlier out but lost the link but
I am sure I am not the only one who read it. However I can go dig it up if
there is interest)
Why are we still using lead-free solder again? So it goes....
Joe
"Davide de Maio of National Physical Laboratory discussed the high
frequency vibration testing of tin-lead and lead-free solder joints, with reference
to automotive and aerospace electronics--a grim reminder that 80% of
failures in airborne electronics were attributable to vibration and shock. A test
piece had been designed representing a single solder joint between two copper
components, which was tested to failure at frequencies of 400Hz and 800Hz.
A range of SAC lead-free solders had been evaluated, with tin-lead as a
comparison.
The tin-lead solder outperformed the lead-free examples, especially at the
higher frequency. In general, failure occurred at or near the intermetallic
interface, which would be expected to be the most stressed area. Of the SAC
alloys, performance at 400Hz was better the higher the silver content.
Annealing of SAC had a deleterious effect on performance at both 400Hz and
800Hz."
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