Hello,

The BGA device was not reworked after initial assembly.  For whatever
reason, the people who thought they were being slick with their aftermarket
heat sink also decided to put way too much thermal compound on the
component.

There probably is a difference in the corner heights but I do not have the
equipment to measure it properly.

Thank you,
 
David Tremmel
872 S. Milwaukee Ave, #253
Libertyville, IL 60048
847 557-9574 - Phone
847 557-9573 - Fax
http://ValuRecovery.com
 
VALUE RECOVERY
Quality is the nature of the service

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez
Sent: Monday, December 08, 2008 7:12 AM
To: [log in to unmask]
Subject: Re: [TN] RE: Xbox360 BGA issue

Was the BGA device reworked after initial assembly soldering process?
I see unusual flux residue on the carrier surface.   Also, a higher mag
pics to truly see the two end corner height differences.   I do see a
reasonable deflection from on end to another.

http://stevezeva.homestead.com/files/Xbox_GPU_A.jpg

victor,


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory
Sent: Monday, December 08, 2008 7:03 AM
To: [log in to unmask]
Subject: [TN] RE: Xbox360 BGA issue

Mornin' David!
 
Got your picture, and I have it posted. It's at:
 
http://stevezeva.homestead.com/files/Xbox_GPU_A.jpg
 
BOY! Them balls are really smooshed!
 
Steve

 

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