Hi Victor,
Normally these pics open--now I am on the road and things get even more difficult.
It is not the weight but the different thermal expansion of the various BGA ayers.

Werner


 


 

-----Original Message-----
From: [log in to unmask]
To: [log in to unmask]
Cc: [log in to unmask]
Sent: Sun, 7 Dec 2008 1:29 pm
Subject: RE: [TN] ??: Re: [TN] BGA soldering open issue























Werner,



?



?? I was unable to open the
file.? ?I can see the borders.? ?I too was not aware that
attached H/S could cause solder bump open issues. ??What is the least
recommended H/S weight that would not cause a BGA solder bump issues? ??Can
you share supporting data/documentation/case study?



?



Victor,



?
















From:
[log in to unmask] [mailto:[log in to unmask]] 

Sent: Friday, December 05, 2008
3:37 PM

To: Hernandez, Victor G; [log in to unmask]

Subject: Re: [TN] ??: Re: [TN] BGA
soldering open issue






?



Hi Victor,

Here it is:



Werner








 


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